Matt Booker
We are thrilled to share some exciting news: UK, has successfully launched 12”/300mm wafer dicing capabilities at our Scottish packaging facility. This enhancement marks a significant milestone for us and is a critical step in bolstering support for the UK and European semiconductor industry.
As many of you are aware, 300mm wafers are becoming the backbone of semiconductor manufacturing globally. Currently, approximately 160 wafer fabrication plants are producing these larger wafers, with the number expected to reach 200 by 2026. This shift from the previous standard of 200mm (8”) wafers to 300mm wafers reflects the growing demand for larger area die, such as processors and CMOS image sensors, and the drive to increase efficiency and reduce costs in ASICs and power electronics devices.
Our new 12” wafer dicing capability allows us to integrate seamlessly with our automated assembly lines, including overmoulded plastic QFN production, hermetic packaging, and chip-on-board assembly. This means we can now pick customer chips directly from diced wafers and bond them onto package leadframes or substrates with even greater precision and efficiency.
Additionally, our facility is now equipped to offer wafer thinning through backgrind processes, with expertise in mounting and dicing wafers as thin as 100um. We also have the capability to handle substrates up to 1mm thick. Our flexibility in processing various wafer and substrate materials—including Silicon, MPWs, GaAs, GaN, FR4, Glass, Ceramics, and Laminates—positions us as a versatile and reliable partner for our customers.
This new capability underscores our commitment to providing a comprehensive European OSAT (Outsourced Semiconductor Assembly & Test) service. From electronic wafer sort/probing to final test and qualification, our expanded services ensure that we remain at the forefront of the semiconductor packaging industry.
We invite you to explore more about our packaging capabilities at packaging.altertechnology.com. For any questions or further details, please feel free to reach out to Matt Booker, our Commercial & Innovation Director.
