Our new equipment in the technology analysis lab at Hirex is a MIP (Microwave Induced Plasma) decapsulation system from Jiaco-instruments.
The success of failure analysis/construction analysis/SEE test depends on the quality of sample preparation.
Decapsulation of a semiconductor package requires selective removal of the encapsulant material while preserving the bond wires, re-distribution metal, bond pads, passivation, die, and the original failure sites.
This MIP is an atmospheric and halogen free technique which especially answers to the new challenge of the de-capsulation of integrated circuit devices using Cu, Ag wires, Multi Chip Module and High-Tg molding compound.
Silver wire MIP
Copper ball bonding at SEM