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    Technology Analysis Laboratory

       

       

      DECAPSULATION SYSTEM

      Our new equipment in the technology analysis lab at Hirex is a MIP (Microwave Induced Plasma) decapsulation system from Jiaco-instruments.

      The success of failure analysis/construction analysis/SEE test depends on the quality of sample preparation.

      Decapsulation of a semiconductor package requires selective removal of the encapsulant material while preserving the bond wires, re-distribution metal, bond pads, passivation, die, and the original failure sites.

      This MIP is an atmospheric and halogen free technique which especially answers to the new challenge of the de-capsulation of integrated circuit devices using Cu, Ag wires, Multi Chip Module and High-Tg molding compound.

       

       

      Silver wire MIP

       

       

      Copper ball bonding at SEM

       

       

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