The European project ORIONAS (Lasercom-on-chip for next generation, high-speed satellite constellation interconnectivity) was launched on 1st November 2018 with the kick-off meeting held in Toulouse, France on 19th November 2018. The duration of the project is 3 years.
ORIONAS is focusing on the development of electronic-photonic integrated circuits (ePICs) for next generation, high speed inter-satellite laser communications.
ORIONAS aims to disrupt the way lasercom modems are designed, built and qualified in order to enable low C-SWAP satellite constellation lasercom links. ORIONAS will squeeze the current bulk lasercom modems into monolithic InP and BICMOS ePICs using cost-effective multi-project wafer run (MPW) fabrication within European foundries. ORIONAS will package the ePICs using hi-rel module assembly processes and will develop a 50 Gb/s laser-mini-modem suitable for a new-gen low c-swap lasercom terminals.
ORIONAS brings together leading European innovators from industry and academia for achieving its challenging technology objectives that require expertise spanning from III-V integration, silicon photonics, high speed electronic IC design, optoelectronic assembly/integration and photonic packaging. System applicability and specifications are driven by Thales Alenia Space - a leading European satellite manufacturer.
LEO Space Photonics R&D Greece
IHP Leibniz-Institut für innovative Mikroelektronik Germany
Thales Alenia Space France
Gooch & Housego (Torquay) Ltd UK
III-V LAB France
Thales Alenia Space Switzerland
CNIT Consorzio Nazionale Interuniversitario per le Telecomunicazioni Italy
OPTOCAP Ltd UK
More information on this project is available at: www.space-orionas.eu
H2020-SPACE Research Executive Agency Research & Innovation Project