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United Kingdom

ALTER UK

Edinburgh & Glasgow

ALTER Spain hosts our global headquarters, where we deliver advanced testing and certification for semiconductors and equipment. Serving the space, aeronautics, defence, and telecommunications markets, our expertise ensures reliability and trust for customers worldwide.

Technician working with a small photonic butterfly device under a microscope.

Engineering and testing of components and equipment

We provide outsourced assembly, packaging and testing of microelectronic semiconductor devices such as ICs, ASICs, MEMS, sensors, laser diodes, LEDs, VCSELs and discrete.

We offer a one-stop shop offering a complete back-end service for IC manufacturers, from package design, assembly and packaging, testing and qualification.

Our expertise in semiconductor packaging solutions spans the full product life-cycle: from design through prototyping, process optimization, product qualification, failure analysis and volume manufacturing.

Focus areas of expertise

High-Reliability Laser Diode Module

Photonics

Packaging and assembly of a wide range of photonic integrated circuit devices including silicon photonics and inP PIC devices.
Plastic QFN

Packaging

Cost-effective semiconductor packaging, from rapid IC prototyping to QFN and hermetic solutions, ensuring reliability, scalability, and performance.
Die-bonding

Assembly

We deliver wafer sawing, die bonding, plastic encapsulation, wire bonding, flip-chip, optical alignment, and hermetic sealing for advanced semiconductor packaging.

Our Locations in UK

Lab & Production

Edinburgh

Our Edinburgh site combines state-of-the-art laboratories and production facilities.
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Design Centre

Glasgow

Glasgow hosts our Design Centre, where creativity and engineering converge to develop tuture-ready technologies.
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Explore All That We Do

Packaging and Assembly Lab
Photonics Assembly