HEOP-HyVIS
Training the next generation of specialists to drive integrated photonics from terrestrial applications into space.
Training the next generation of specialists to drive integrated photonics from terrestrial applications into space.
High Electro-Optical Performance Hybrid Visible Image sensor HEOP-HyViS is an ESA-funded technology development project conducted under ESA AO/1-9801/19/NL/AR. The project addresses the design, fabrication, and validation of a radiation-tolerant hybrid visible image sensor targeting future spaceborne optical instruments.
The sensor architecture is based on a hybridized solution combining a Silicon Photon Detection Array (SiPDA) detection layer with a dedicated Read-Out Integrated Circuit (ROIC). The ROIC integrates two functional blocks: an analogue front-end and an ADC/control block. Hybridization is achieved through large-scale flip-chip bonding (~1 million bumps), followed by advanced packaging.
The project covers the full development chain, including requirements consolidation, system architecture definition, preliminary and detailed design, layout and verification, wafer fabrication, hybridization, assembly, and extensive test, measurement, and characterization activities. Performance validation includes functional, electrical, and environmental testing, as well as Total Ionizing Dose (TID) and proton radiation campaigns.
The final phase focuses on performance assessment, identification of improvement areas, and recommendations for industrialization and scalable production of hybrid detectors.
The project is led by Space Asics (Greece), with Imasenic and Alter Technology, both from Spain as partners.