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Providing contract package design and assembly service

OPTOCAP is a technology oriented company active in the field of optoelectronics, microelectronics and MEMS packaging design and assembly services. Its turn-key packaging services enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. OPTOCAP works in a wide variety of industrial sectors for which quality and reliability is a must along with an efficient supply chain.

APPLICATIONS

  • Silicon Photonics
  • Quantum
  • Hi-Rel Assembly
  • Flip Chip
  • System in Package
  • Led Chip on Board
  • Sensor Assembly
  • Chip on Board
  • Fast-turn IC Assembly
  • Photonic Packaging
  • RF and Microwave
  • MEMS

ASSEMBLY PROCESSES

  • Wafer Sawing
  • Pick and Place
  • Die Bonding
  • Wire Bonding
  • Bumping and Flip Chip
  • Encapsulation and Hermetic Sealing
  • Optical alignment

DESIGN

  • Optical Design
  • Package Design and Modelling

PRODUCTS

Narrow linewidth lasers are a key enabling technology in application areas as diverse as holography, remote sensing, spectroscopy and quantum technologies. In the quantum technology area alone, these sources are at the heart of atomic clocks, gravitometers and inertial navigation sensors empowered by laser-cooled atoms.

With the launch of the FLAME and REMOTE product lines, Optocap has applied their pedigree in telecoms and space qualified devices to narrow linewidth lasers. This new generation of compact, stable and reliable lasers opens the door to real world applications of narrow linewidth lasers outside of the laboratory environment.


OPTOCAP

5 Bain Square
EH54 7DQ Livingston, Scotland, UK

+44(0)1506 403 550

info@optocap.com